This standard specifies the technical requirements, inspection methods, inspection rules, packaging, marking, transportation, storage and safety requirements for silane gas used in the electronics industry. This standard is mainly used in the electronics industry for epitaxial deposition of polysilicon and single crystal silicon, low-temperature chemical vapor deposition of silicon dioxide, deposition of amorphous silicon films, etc. Molecular formula: SiH4 Relative molecular mass: 32.117 (according to the international relative atomic mass in 1991). Boiling point at 101.3kPa: -112°C Gas density at 20°C and 101.3kPa: 1.342kg/m3. Liquid density at -185°C: 711kg/m3.