GB/T 6620-1995
Test method for measuring warp on silicon slices by nontact scanning (English Version)

Standard No.

GB/T 6620-1995

Language

Chinese, Available in English version

Release Date

1995

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Status

Be replaced 2010-06

Replace By

GB/T 6620-2009

Latest

GB/T 6620-2009

Scope

This standard specifies the non-contact measurement method for the warpage of silicon single crystal cutting wafers, grinding wafers and polishing wafers (hereinafter referred to as silicon wafers). This standard is suitable for measuring the warpage of circular silicon wafers with a diameter greater than 50mm and a thickness of 150-1000μm. This standard is also suitable for measuring the warpage of other semiconductor wafers.

GB/T 6620-1995 history

• 2009 GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning
• 1995 GB/T 6620-1995 Test method for measuring warp on silicon slices by nontact scanning