GB/T 6619-1995
Test methods for bow of silicon slices (English Version)
- Standard No.
- GB/T 6619-1995
- Language
- Chinese, Available in English version
- Release Date
- 1995
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Status
- 2010-06
- Replace By
- GB/T 6619-2009
- Latest
- GB/T 6619-2009
- Scope
- This standard specifies the contact measurement method for the curvature of silicon single crystal cutting wafers, grinding wafers and polishing wafers (hereinafter referred to as silicon wafers). This standard is suitable for measuring the curvature of circular silicon wafers with a diameter greater than 50mm and a thickness of 200-1000μm. This standard is also applicable to the measurement of curvature of other semiconductor wafers.
GB/T 6619-1995 history
- 2009 GB/T 6619-2009 Test method for bow of silicon wafers
- 1995 GB/T 6619-1995 Test methods for bow of silicon slices
