This standard specifies the discrete point and scanning measurement methods for the thickness and total thickness variation of silicon single crystal cut, ground and polished wafers (silicon wafers for short).
GB/T 6618-1995 history
2009GB/T 6618-2009 Test method for thickness and total thickness variation of silicon slices
1995GB/T 6618-1995 Test method for thickness and total thickness variation of silicon slices