GB/T 6618-1995
Test method for thickness and total thickness variation of silicon slices (English Version)

Standard No.
GB/T 6618-1995
Language
Chinese, Available in English version
Release Date
1995
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Status
 2010-06
Replace By
GB/T 6618-2009
Latest
GB/T 6618-2009
Scope
This standard specifies the discrete point and scanning measurement methods for the thickness and total thickness variation of silicon single crystal cut, ground and polished wafers (silicon wafers for short).

GB/T 6618-1995 history

  • 2009 GB/T 6618-2009 Test method for thickness and total thickness variation of silicon slices
  • 1995 GB/T 6618-1995 Test method for thickness and total thickness variation of silicon slices
Test method for thickness and total thickness variation of silicon slices



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