DIN EN IEC 60749-20:2019
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019
- Standard No.
- DIN EN IEC 60749-20:2019
- Release Date
- 2019
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN IEC 60749-20:2023-07
- Latest
- DIN EN IEC 60749-20:2023-07
DIN EN IEC 60749-20:2019 history
- 2023 DIN EN IEC 60749-20:2023-07 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020 / Note: DIN EN 60749-20 (2010...
- 2019 DIN EN IEC 60749-20:2019 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019
