DIN EN IEC 60749-20:2023-07
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020 / Note: DIN EN 60749-20 (2010...

Standard No.

DIN EN IEC 60749-20:2023-07

Release Date

2023

Published By

German Institute for Standardization

Latest

DIN EN IEC 60749-20:2023-07

DIN EN IEC 60749-20:2023-07 history

• 2023 DIN EN IEC 60749-20:2023-07 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020 / Note: DIN EN 60749-20 (2010...
• 2019 DIN EN IEC 60749-20:2019 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019