DIN EN 61189-5-503:2018-01
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017)...
- Standard No.
- DIN EN 61189-5-503:2018-01
- Release Date
- 2018
- Published By
- German Institute for Standardization
- Latest
- DIN EN 61189-5-503:2018-01
DIN EN 61189-5-503:2018-01 history
- 2018 DIN EN 61189-5-503:2018-01 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017)...
- 1970 DIN EN 61189-5-503 E:2016-02
DIN EN 61189-5-503:2018-01 -All Parts
DIN EN 61189-11:2014-02 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013
DIN EN 61189-1:2002-04 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997 + A1:2001); German version EN 61189-1:1997 + A1:2001 / Note: DIN EN 61189-1 (1997...
DIN EN 61189-2-719 E:2015-02
DIN EN 61189-2-719:2017-04 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-...
DIN EN 61189-2-721 E:2013-11
DIN EN 61189-2-721:2016-03 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad la...
DIN EN 61189-2:2007-01 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006); German version EN 61189-2:2006 / Note: DIN EN 61189-2 (200...
DIN EN 61189-3-719 E:2014-04
DIN EN 61189-3-719:2016-12 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change duri...
DIN EN 61189-3-913 E:2012-01
DIN EN 61189-3-913 E:2014-09
DIN EN 61189-3:2008-06 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008 / Note: DIN EN 61189-3 (...
DIN EN 61189-5:2007-05 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006 / Note: A transition period, as set out in DIN EN 61189-5-2 (2015-11...
DIN EN 61189-6:2007-03 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006