DIN EN 61189-3-913 E:2012-01

Standard No.
DIN EN 61189-3-913 E:2012-01
Release Date
1970
Published By
/
Status
Replace By
DIN EN 61189-3-913 E:2014-09
Latest
DIN EN 61189-3-913 E:2014-09

DIN EN 61189-3-913 E:2012-01 history

DIN EN 61189-3-913 E:2012-01 -All Parts

DIN EN 61189-11:2014-02 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013 DIN EN 61189-1:2002-04 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997 + A1:2001); German version EN 61189-1:1997 + A1:2001 / Note: DIN EN 61189-1 (1997... DIN EN 61189-2-719 E:2015-02 DIN EN 61189-2-719:2017-04 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-... DIN EN 61189-2-721 E:2013-11 DIN EN 61189-2-721:2016-03 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad la... DIN EN 61189-2:2007-01 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006); German version EN 61189-2:2006 / Note: DIN EN 61189-2 (200... DIN EN 61189-3:2008-06 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008 / Note: DIN EN 61189-3 (... DIN EN 61189-5-1 E:2014-10 DIN EN 61189-5-1:2017-04 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 6118... DIN EN 61189-5-2 E:2013-04 DIN EN 61189-5-2:2015-11 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version E... DIN EN 61189-5-3 E:2013-07 DIN EN 61189-5-3:2015-11 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version ... DIN EN 61189-5-4 E:2013-07 DIN EN 61189-5-4:2015-11 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (I... DIN EN 61189-5-503 E:2016-02 DIN EN 61189-5-503:2018-01 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017)... DIN EN 61189-5-504 E:2018-02 DIN EN 61189-5:2007-05 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006 / Note: A transition period, as set out in DIN EN 61189-5-2 (2015-11... DIN EN 61189-6:2007-03 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006


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