This SAE Recommended Practice defines a method for evaluating the near field electric or magnetic component of the electromagnetic field at the surface of an integrated circuit (IC). This technique is capable of providing a detailed pattern of the RF sources internal to the IC. The resolution of the pattern is determined by the characteristics of the probes used and the precision of the mechanical probe positioner. The method is usable over the 10 MHz to 3 GHz frequency range with existing probe technology. The probe is mechanically scanned according to a programmed pattern in a plane parallel or perpendicular to the IC surface and the data is computer processed to provide a color-enhanced representation of field strength at the scan frequency. This procedure is applicable to measurements from an IC mounted on any circuit board that is accessible to the scan probe. For comparisons, the standardized test board shall be used.
SAE J1752/2-2003 history
2016SAE J1752/2-2016 Measurement of Radiated Emissions from Integrated Circuits—Surface Scan Method (Loop Probe Method) 10 MHz to 3 GHz
2011SAE J1752/2-2011 Measurement of Radiated Emissions from Integrated Circuits—Surface Scan Method (Loop Probe Method) 10 MHz to 3 GHz
2003SAE J1752/2-2003 Measurement of Radiated Emissions from Integrated Circuits -- Surface Scan Method (Loop Probe Method) 10 MHz to 3 GHz
1995SAE J1752/2-1995 Measurement of Radiated Emissions From Integrated Circuits-Surface Scan Method (Loop Probe Method) 10 Mhz to 3 Ghz