GB/T 41213-2021
Integrated circuit full automatic die bonder (English Version)

Standard No.

GB/T 41213-2021

Language

Chinese, Available in English version

Release Date

2021

Published By

国家市场监督管理总局、中国国家标准化管理委员会

Latest

GB/T 41213-2021

Scope

This document specifies the structure, classification, basic parameters, working conditions, requirements, test methods, inspection rules, signs, packaging, transportation and storage of fully automatic chip loaders for integrated circuits. This document applies to fully automatic chip loaders for integrated circuit packaging.

GB/T 41213-2021 Referenced Document

• GB 50073-2013 Code for design of clean room
• GB/T 13306 Plates
• GB/T 191 Packaging.Pictorial marking for handling of goods
• GB/T 5226.1-2019 Electrical safety of machinery—Electrical equipment of machines—Part 1:General requirements

GB/T 41213-2021 history

• 2021 GB/T 41213-2021 Integrated circuit full automatic die bonder