GB/T 35010.6-2018
Semiconductor die products—Part 6: Requirements for concerning thermal simulation (English Version)

Standard No.: GB/T 35010.6-2018
Language: Chinese, Available in English version
Release Date: 2018
Published By: 中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会
Latest: GB/T 35010.6-2018

GB/T 35010.6-2018 history

2018 GB/T 35010.6-2018 Semiconductor die products—Part 6: Requirements for concerning thermal simulation

GB/T 35010.6-2018 -All Parts

GB/T 35010.1-2018 Semiconductor die products—Part 1：Requirements for procurement and use GB/T 35010.2-2018 Semiconductor die products—Part 2: Exchange data formats GB/T 35010.3-2018 Semiconductor die products—Part 3: Guide for handling, packing and storage GB/T 35010.4-2018 Semiconductor die products—Part 4: Requirements for die users and suppliers GB/T 35010.5-2018 Semiconductor die products—Part 5：Requirements for concerning electrical simulation GB/T 35010.6-2018 Semiconductor die products—Part 6: Requirements for concerning thermal simulation GB/T 35010.7-2018 Semiconductor die products—Part 7: XML schema for data exchange GB/T 35010.8-2018 Semiconductor die products—Part8: EXPRESS model schema for data exchange

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