VDI/VDE 3713 Blatt 8-1995
Technical procurement specification - Epoxy encapsulants for semiconductor chips
- Standard No.
- VDI/VDE 3713 Blatt 8-1995
- Release Date
- 1995
- Published By
- Association of German Mechanical Engineers
- Status
- Latest
- VDI/VDE 3713 Blatt 8-1995
- Replace
- VDI/VDE 3713 Blatt 8-1993
- Scope
- The document describes epoxy covering compounds that are preferably used for covering semiconductor chips.*www.vdi.de/3713
VDI/VDE 3713 Blatt 8-1995 Referenced Document
- ASTM D2566-86 Test Method for Linear Shrinkage of Cured Thermosetting Casting Resins During Cure
- DIN 50049:1992
VDI/VDE 3713 Blatt 8-1995 history
- 1995 VDI/VDE 3713 Blatt 8-1995 Technical procurement specification - Epoxy encapsulants for semiconductor chips
- 1993 VDI/VDE 3713 Blatt 8-1993 Technische Liefervorschrift; Epoxidabdeckmassen fuer Halbleiterchips
