GB/T 14862-1993
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits (English Version)

Standard No.

GB/T 14862-1993

Language

Chinese, Available in English version

Release Date

1993

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 14862-1993

Scope

This standard specifies the test method for the junction-to-case thermal resistance of semiconductor integrated circuit packages. This standard is applicable to the measurement of junction-to-case thermal resistance of semiconductor integrated circuits ceramic, metal and plastic packages.

GB/T 14862-1993 history

• 1993 GB/T 14862-1993 Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits