GB/T 13555-1992
Flexible copper-clad polyimide flim for printed circuits (English Version)
- Standard No.
- GB/T 13555-1992
- Language
- Chinese, Available in English version
- Release Date
- 1992
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Status
- 2019-01
- Replace By
- GB/T 13555-2017
- Latest
- GB/T 13555-2017
- Scope
- This standard specifies the performance requirements of flexible copper-clad polyimide films for printed circuits. This standard applies to flexible copper-clad polyimide films for printed circuits. This standard stipulates "optional" technical requirements, which are only applicable if agreed between the supplier and the purchaser. In the absence of requirements, if all technical requirements not marked "for optional" are met, it is considered to comply with this standard.
GB/T 13555-1992 history
- 2017 GB/T 13555-2017 Copper-clad polyimide film laminates for flexible printed circuits
- 1992 GB/T 13555-1992 Flexible copper-clad polyimide flim for printed circuits
