JIS C 62137-4:2016
Electronics assembly technology -- Part 4: Endurance test methods for solder joint of area array type package surface mount devices

Standard No.

JIS C 62137-4:2016

Release Date

2016

Published By

Japanese Industrial Standards Committee (JISC)

Latest

JIS C 62137-4:2016

JIS C 62137-4:2016 history

• 2016 JIS C 62137-4:2016 Electronics assembly technology -- Part 4: Endurance test methods for solder joint of area array type package surface mount devices