EN ISO 9453:2014
Soft solder alloys - Chemical compositions and forms

Standard No.

EN ISO 9453:2014

Release Date

2014

Published By

European Committee for Standardization (CEN)

Status

Be replaced 2021-01

Replace By

EN ISO 9453:2020

Latest

EN ISO 9453:2020

Replace

FprEN ISO 9453:2014

Scope

This International Standard specifies the chemical composition requirements for solders containing two or more of the following elements: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium; Information on generally available delivery forms is also included.

EN ISO 9453:2014 Referenced Document

• IEC 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• ISO 3677:1992 Filler metal for soft soldering, brazing and braze welding; designation

EN ISO 9453:2014 history

• 2020 EN ISO 9453:2020 Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
• 2014 EN ISO 9453:2014 Soft solder alloys - Chemical compositions and forms
• 2006 EN ISO 9453:2006 Soft solder alloys - Chemical compositions and forms ISO 9453:2006; Supersedes EN 29453:1993