This specification specifies the terms and definitions, grades, requirements, test methods, inspection rules, packaging, marking, storage and transportation of silicon carbide single crystal polished wafers. This specification applies to silicon carbide single crystal polished wafers with crystal forms 6H and 4H, single or double-sided polishing, and diameters of 100 mm and below. Silicon carbide single crystal polishing wafers of other crystal forms or sizes can be used as a reference.
SJ/T 11502-2015 history
2015SJ/T 11502-2015 Specification for polished monocrystalline silicon carbide wafers