KS C IEC 60749-14:2006
Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)

Standard No.

KS C IEC 60749-14:2006

Release Date

2006

Published By

Korean Agency for Technology and Standards (KATS)

Status

Be replaced

Replace By

KS C IEC 60749-14-2006(2016)

Latest

KS C IEC 60749-14-2021

Scope

This specification specifies the lead/package interface and the accompanying leads when reassembling defective boards.

KS C IEC 60749-14:2006 history

• 2021 KS C IEC 60749-14-2021 Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)
• 0000 KS C IEC 60749-14-2006(2016)
• 2006 KS C IEC 60749-14:2006 Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)