NF C96-050-22*NF EN 62047-22:2014
Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates

Standard No.

NF C96-050-22*NF EN 62047-22:2014

Release Date

2014

Published By

Association Francaise de Normalisation

Latest

NF C96-050-22*NF EN 62047-22:2014

Scope

This part of IEC 62047 specifies a tensile test method for measuring the electromechanical properties of microelectromechanical systems (MEMS) materials of thin conductive films bonded to flexible, non-conductive substrates. Thin film structures on flexible substrates are widely used in MEMS, consumer products, and flexible-mounted electronics. The electrical behavior of layers on flexible substrates differs from that of independent layers and substrates due to interactions linked to the interfaces. Different sub combinations

NF C96-050-22*NF EN 62047-22:2014 Referenced Document

• ISO 527-3 Plastics — Determination of tensile properties — Part 3: Test conditions for films and sheets*， 2018-11-05 Update

NF C96-050-22*NF EN 62047-22:2014 history

• 2014 NF C96-050-22*NF EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates