General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 30857-2014
Scope
This standard specifies the test method for whether the thickness and thickness variation of sapphire single crystal cutting, grinding and polishing wafers (referred to as substrate wafers) for the preparation of gallium nitride thin film epitaxial wafers and other uses meet the standard limit requirements. This standard applies to the testing of the thickness and thickness variation of sapphire substrates.
GB/T 30857-2014 Referenced Document
GB/T 14264 Semiconductor materials-Terms and definitions
GB/T 30857-2014 history
2014GB/T 30857-2014 Standard test method for thickness and thickness variation on sapphire substrates