YB/T 4397-2014
Brass plating steel sawing wire for silicon chip (English Version)
- Standard No.
- YB/T 4397-2014
- Language
- Chinese, Available in English version
- Release Date
- 2014
- Published By
- Professional Standard - Ferrous Metallurgy
- Latest
- YB/T 4397-2014
- Scope
- This standard specifies the terms and definitions, marking method, size, shape, length and allowable deviations, ordering content, technical requirements, test methods, inspection rules and packaging, marking, transportation, storage and quality of electroplated brass wire for cutting silicon wafers. Certificates and other requirements. This standard applies to electroplated brass steel wire (hereinafter referred to as steel wire) for cutting silicon wafers with a nominal diameter ranging from 80 μm to 350 μm.
YB/T 4397-2014 Referenced Document
- GB/T 228.1 Metallic materials—Tensile testing—Part 1: Method of test at room temperature*， 2021-12-31 Update
- GB/T 24242.4 Non-alloy steel wire rod for conversion to wire —Part 4：Specific requirements for special purpose wire rod*， 2020-09-29 Update
- GB/T 341 Steel wire.Classification and terminology
- YB/T 135 Test method for coating weight and composition of copper-plated steel wire*， 2017-11-07 Update
YB/T 4397-2014 history
- 2014 YB/T 4397-2014 Brass plating steel sawing wire for silicon chip
