JB/T 6173-2014
Fluxes for no-clean and lead-free (English Version)
- Standard No.
- JB/T 6173-2014
- Language
- Chinese, Available in English version
- Release Date
- 2014
- Published By
- Professional Standard - Machinery
- Latest
- JB/T 6173-2014
- Replace
- JB/T 6173-1992
- Scope
- This standard specifies the terms and definitions, requirements, test methods, inspection rules, packaging, marking, transportation and storage of no-clean lead-free flux (hereinafter referred to as flux). This standard applies to no-clean lead-free flux.
JB/T 6173-2014 Referenced Document
- GB 190-2009 Packing symbol of dangerous goods
- GB/T 191-2008 Packaging.Pictorial marking for handling of goods
- GB/T 2040-2008 Sheet of copper and copper alloy
- GB/T 2423.32-2008 Environmental testing for electric and electronic products.Part 2:Test methods.Test Ta:Solderability test by the wetting balance method
- GB/T 2828.1-2012 Inspection procedure by count sampling part 1: Lot by lot inspection sampling plan retrieved by acceptance quality limit (AQL)
- GB/T 2829-2002 Sampling procedures and tables for periodic inspection by attributes (Apply to inspection of process stability)
- GB/T 611-2006 Chemical reagent-General method for the determination of density
- GB/T 9724-2007 Chemical reagent.General rule for the determination of pH
- SH 0164-1992 Rules for Packaging, Storage, Transportation and Delivery of Petroleum Products
JB/T 6173-2014 history
- 2014 JB/T 6173-2014 Fluxes for no-clean and lead-free
- 1970 JB/T 6173-1992 Water soluble organic soldering flux
