GOST R 55492-2013
Electronics assembly technology. Part 3. Selection guidance of environmental and endurance test methods for solder joints

Standard No.

GOST R 55492-2013

Release Date

2013

Published By

RU-GOST R

Latest

GOST R 55492-2013

GOST R 55492-2013 Referenced Document

• IEC 61188-5 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

GOST R 55492-2013 history

• 2013 GOST R 55492-2013 Electronics assembly technology. Part 3. Selection guidance of environmental and endurance test methods for solder joints