JIS C 5630-13:2014
Semiconductor devices.Micro-electromechanical devices.Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Standard No.

JIS C 5630-13:2014

Release Date

2014

Published By

Japanese Industrial Standards Committee (JISC)

Latest

JIS C 5630-13:2014

JIS C 5630-13:2014 Referenced Document

• JIS C 5630-2 Semiconductor devices -- Micro-electromechanical devices-- Part 2: Tensile testing method of thin film materials

JIS C 5630-13:2014 history

• 2014 JIS C 5630-13:2014 Semiconductor devices.Micro-electromechanical devices.Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures