JIS C 5630-12:2014
Semiconductor devices.Micro-electromechanical devices.Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- Standard No.
- JIS C 5630-12:2014
- Release Date
- 2014
- Published By
- Japanese Industrial Standards Committee (JISC)
- Latest
- JIS C 5630-12:2014
JIS C 5630-12:2014 Referenced Document
- ISO 12107 Metallic materials - Fatigue testing - Statistical planning and analysis of data
- JIS C 5630-3 Semiconductor devices -- Micro-electromechanical devices-- Part 3: Thin film standard test piece for tensile testing
JIS C 5630-12:2014 history
- 2014 JIS C 5630-12:2014 Semiconductor devices.Micro-electromechanical devices.Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
