KS D 8546-2008
Lead free soft solder alloys－Chemical compositions and forms

Standard No.

KS D 8546-2008

Release Date

2008

Published By

Korean Agency for Technology and Standards (KATS)

Status

Be replaced

Replace By

KS D 8546-2018

Latest

KS D 8546-2023

Scope

This standard contains tin, antimony, silver, bismuth, copper, zinc and indium and does not contain lead.

KS D 8546-2008 history

• 2023 KS D 8546-2023 Lead free soft solder alloys — Chemical compositions and forms
• 2018 KS D 8546-2018 Lead free soft solder alloys — Chemical compositions and forms
• 2008 KS D 8546-2008 Lead free soft solder alloys－Chemical compositions and forms