DS/EN 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Standard No.

DS/EN 62047-18:2013

Release Date

2013

Published By

Danish Standards Foundation

Latest

DS/EN 62047-18:2013

Scope

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece

DS/EN 62047-18:2013 history

• 2013 DS/EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials