KS C IEC 60749-20:2005
Semiconductor devices－Mechanical and climatic test methods－ Part 20：Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Standard No.

KS C IEC 60749-20:2005

Release Date

2005

Published By

Korean Agency for Technology and Standards (KATS)

Status

Be replaced

Replace By

KS C IEC 60749-20:2020

Latest

KS C IEC 60749-20:2020

Scope

This standard applies to semiconductor devices (individual devices and integrated circuits). This test is performed with a plastic cap.

KS C IEC 60749-20:2005 history

• 2020 KS C IEC 60749-20:2020 Semiconductor devices — Mechanical and climatic test methods — Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
• 2005 KS C IEC 60749-20:2005 Semiconductor devices－Mechanical and climatic test methods－ Part 20：Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat