KS C IEC 60749-19:2005
Semiconductor devices－Mechanical and climatic test methods－Part 19：Die shear strength

Standard No.

KS C IEC 60749-19:2005

Release Date

2005

Published By

Korean Agency for Technology and Standards (KATS)

Status

Be replaced

Replace By

KS C IEC 60749-19:2020

Latest

KS C IEC 60749-19:2020

Scope

This specification is used to attach a semiconductor die or packaged passive component to a package header or other substrate.

KS C IEC 60749-19:2005 history

• 2020 KS C IEC 60749-19:2020 Semiconductor devices — Mechanical and climatic test methods — Part 19: Die shear strength
• 2005 KS C IEC 60749-19:2005 Semiconductor devices－Mechanical and climatic test methods－Part 19：Die shear strength