KS C 0287-2002
Environmental test－Tests－Test Td：Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting device(SMD)

Standard No.

KS C 0287-2002

Release Date

2002

Published By

Korean Agency for Technology and Standards (KATS)

Status

Be replaced

Replace By

KS C 0287-2002(2017)

Latest

KS C 0287-2022

Replace

KS C 0287-1997

Scope

This standard applies to surface mount components (SMD). Soldering of other electronic components and SMDs

KS C 0287-2002 history

• 2022 KS C 0287-2022 Environmental test－Tests－Test Td：Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting device(SMD)
• 0000 KS C 0287-2002(2017)
• 2002 KS C 0287-2002 Environmental test－Tests－Test Td：Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting device(SMD)
• 0000 KS C 0287-1997