KS C IEC 61249-5-1:2003
Materials for interconnection structures－Part 5：Sectional specification set for conductive foils and films with and without coatings－Section 1：Copper foils (for the manufacture of copper-clad base materials)

Standard No.

KS C IEC 61249-5-1:2003

Release Date

2003

Published By

Korean Agency for Technology and Standards (KATS)

Status

Be replaced 2019-01

Replace By

KS C IEC 61249-5-1-2019

Latest

KS C IEC 61249-5-1-2019

Scope

This specification covers copper-clad sheet used in the manufacture of printed circuit boards and copper-clad flexible substrates.

KS C IEC 61249-5-1:2003 history

• 2019 KS C IEC 61249-5-1-2019
• 2003 KS C IEC 61249-5-1:2003 Materials for interconnection structures－Part 5：Sectional specification set for conductive foils and films with and without coatings－Section 1：Copper foils (for the manufacture of copper-clad base materials)