YS/T 936-2013
Sputtering nickel vanadium alloy target used in integrated circuit device (English Version)
- Standard No.
- YS/T 936-2013
- Language
- Chinese, Available in English version
- Release Date
- 2013
- Published By
- Professional Standard - Non-ferrous Metal
- Latest
- YS/T 936-2013
- Scope
- This standard specifies the requirements, test methods, inspection rules and markings, packaging, transportation, storage, quality certificates and contract or order content for nickel-vanadium alloy sputtering targets for integrated circuit devices. This standard applies to various types of nickel vanadium alloy sputtering targets used in electronic thin film manufacturing.
YS/T 936-2013 Referenced Document
- GB/T 1031 Geometrical Product Specifications(GPS).Surface texture:Profile method.Surface roughness parameters and their values
- GB/T 14265 General rule of chemical analysis for hydrogen,oxygen,nitrogen,carbon and sulfur in metallic materials*， 2017-10-14 Update
- GB/T 6394 Determination of estimating the average grain size of metal*， 2017-02-28 Update
- GJB 1580A Deformed metal ultrasonic testing*， 2019-12-08 Update
- YS/T 837 Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies
YS/T 936-2013 history
- 2013 YS/T 936-2013 Sputtering nickel vanadium alloy target used in integrated circuit device
