IEC 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
- Standard No.
- IEC 62047-18:2013
- Release Date
- 2013
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 62047-18:2013
- Replace
- IEC 47F/155/FDIS:2013
- Scope
- This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0@1 ?? and 10 ??. Thin films are used as main structural materials for Micro-electromechanical Systems (abbreviated as MEMS in this document) and micromachines. The main structural materials for MEMS@ micromachines@ etc.@ have special features@ such as a few micron meter size@ material fabrication by deposition@ photolithography@ and/ or nonmechanical machining test piece. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces@ which enables a guarantee of accuracy corresponding to the special features.
IEC 62047-18:2013 history
- 2013 IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
