DS/EN 62047-13:2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures

Standard No.

DS/EN 62047-13:2012

Release Date

2012

Published By

Danish Standards Foundation

Latest

DS/EN 62047-13:2012

Scope

IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a s

DS/EN 62047-13:2012 history

• 2012 DS/EN 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures