DS/EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

Standard No.

DS/EN 62137-3:2012

Release Date

2012

Published By

Danish Standards Foundation

Latest

DS/EN 62137-3:2012

Scope

This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type de

DS/EN 62137-3:2012 history

• 2012 DS/EN 62137-3:2012 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints