JEDEC JEP167-2013
Characterization of Interfacial Adhesion in Semiconductor Packages

Standard No.

JEDEC JEP167-2013

Release Date

2013

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Latest

JEDEC JEP167-2013

JEDEC JEP167-2013 history

• 2013 JEDEC JEP167-2013 Characterization of Interfacial Adhesion in Semiconductor Packages