YS/T 819-2012
High-purity sputtering copper target used in electronic film (English Version)

Standard No.

YS/T 819-2012

Language

Chinese, Available in English version

Release Date

2012

Published By

Professional Standard - Non-ferrous Metal

Latest

YS/T 819-2012

Scope

This standard specifies the requirements, test methods, inspection rules and markings, packaging, transportation, storage, quality certificate and contract (or order) content for high-purity copper sputtering targets for electronic thin films. This standard applies to various types of high-purity copper sputtering targets used in electronic thin film manufacturing (hereinafter referred to as high-purity copper targets).

YS/T 819-2012 Referenced Document

• GB/T 14265 General rule of chemical analysis for hydrogen,oxygen,nitrogen,carbon and sulfur in metallic materials*， 2017-10-14 Update
• GJB 1580A Deformed metal ultrasonic testing*， 2019-12-08 Update
• YS/T 347 Method for determination of average grain size of copper and copper alloys*， 2020-12-09 Update
• YS/T 837 Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies

YS/T 819-2012 history

• 2012 YS/T 819-2012 High-purity sputtering copper target used in electronic film