LST EN 62047-13-2012 Semiconductor devices - Micro-electromechanical devices -- Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012)
2012LST EN 62047-13-2012 Semiconductor devices - Micro-electromechanical devices -- Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012)