DS/EN ISO 9453:2007
Soft solder alloys - Chemical compositions and forms

Standard No.

DS/EN ISO 9453:2007

Release Date

2007

Published By

Danish Standards Foundation

Latest

DS/EN ISO 9453:2007

Replace

DS/EN 29453:1997

Scope

This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys:. tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;. tin-antimony;. tin-bismuth;. tin-copper, with and without silver;. tin-indium, with and without silver and bismuth;. tin-silver, with and without copper and bismuth;. tin-zinc, with and without bismuth.It also includes an indication of the forms generally available.

DS/EN ISO 9453:2007 history

• 2007 DS/EN ISO 9453:2007 Soft solder alloys - Chemical compositions and forms
• 0000 DS/EN 29453:1997