This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including:- wafers,- singulated bare die,- die and wafers with attached connection structures, and- minimally or partially encapsulated die and wafers.This report contains suggested good practice for the handling, packing and storage of die products.
DS/CLC/TR 62258-3:2007 history
2007DS/CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage