DS/EN 62137/Corr. 1:2007
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Standard No.

DS/EN 62137/Corr. 1:2007

Release Date

2007

Published By

Danish Standards Foundation

Latest

DS/EN 62137/Corr. 1:2007

Scope

Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.

DS/EN 62137/Corr. 1:2007 history

• 2007 DS/EN 62137/Corr. 1:2007 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
• 2007 DS/EN 62137:2007 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN