DS/EN 62047-12:2012 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibrationof microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 ìm to 1 000 ìm in the plane direction and from 1 ìm to 100 ìm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 ìm and 10 ìm in thickness.The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanic
DS/EN 62047-12:2012 history
2012DS/EN 62047-12:2012 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures