This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test.This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component. Test method IEC 60749-37 uses an acc
DS/EN 60749-40:2011 history
2011DS/EN 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge