DS/EN 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND)

Standard No.

DS/EN 60749-16:2003

Release Date

2003

Published By

Danish Standards Foundation

Status

Withdraw

Latest

DS/EN 60749-16:2003

Replace By

ANSI Z80.31-2017

Scope

The purpose of this part of IEC 60749 is to detect the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

DS/EN 60749-16:2003 history

• 2003 DS/EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND)

DS/EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND) was changed to ANSI Z80.31-2017 Ophthalmic Optics - Specifications for Ready-to-Wear Near-Vision Spectacles.