DS/EN 60068-2-58:2005
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Standard No.

DS/EN 60068-2-58:2005

Release Date

2005

Published By

Danish Standards Foundation

Latest

DS/EN 60068-2-58:2005

Replace

DS/EN 60068-2-58-1999

Scope

This part of 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

DS/EN 60068-2-58:2005 history

• 2005 DS/EN 60068-2-58:2005 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)