IEC 60749-21:2005
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Standard No.

IEC 60749-21:2005

Release Date

2005

Published By

International Electrotechnical Commission (IEC)

Status

Withdraw

Replace By

IEC 60749-21:2011

Latest

IEC 60749-21:2011

Scope

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderabili

IEC 60749-21:2005 history

• 2011 IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
• 2005 IEC 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
• 2004 IEC 60749-21:2004 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability