GB/T 28277-2012
Silicon-based MEMS fabrication technology.Measurement method of cutting and pull-press strength of micro bonding area (English Version)

Standard No.

GB/T 28277-2012

Language

Chinese, Available in English version

Release Date

2012

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 28277-2012

Scope

This standard specifies the requirements and test methods for testing the bonding strength of tiny bonding areas involved in the processing of silicon-based MEMS. This standard applies to the shear and tensile and compressive strength tests of tiny bonding areas manufactured by microelectronics technology and related microfabrication technologies.

GB/T 28277-2012 Referenced Document

• GB/T 19022-2003 Measurement management systems-Requirements for measurement processes and measruing equipment
• GB/T 26111-2010 Micro-electromechanical system techology.Terms

GB/T 28277-2012 history

• 2012 GB/T 28277-2012 Silicon-based MEMS fabrication technology.Measurement method of cutting and pull-press strength of micro bonding area