GB/T 27581-2011 (English Version) PDF

Standard No.: GB/T 27581-2011
Language: Chinese, Available in English version
Release Date: 2011
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest: GB/T 27581-2011

Scope: Warning: Some chemical reagents used in this test method are toxic and corrosive, and some experimental processes may lead to dangerous situations. Operators should take appropriate safety and health measures. This standard specifies the determination method of nickel ion and copper ion content in electroless copper plating solution for electromagnetic shielding film. This standard is applicable to the test of nickel ion and copper ion content in electroless copper plating solution for electromagnetic shielding film. Measuring range: the concentration of nickel ions in the electroless copper plating solution is calculated as NiSO₄.6H₂O, and is 0.20g/L～2.00g/L; the concentration of copper ions in the electroless copper plating solution is measured as CuSO₂ Subscript 4>.5H₂O is calculated as 5.0g/L～60.0g/L.

GB/T 27581-2011 Referenced Document

GB/T 601 Chemical reagent.Preparations of reference titration solutions*， 2016-10-13 Update
GB/T 603 Preparation of preparations and products used in chemical reagent test methods*， 2023-08-06 Update
GB/T 6682-2008 Water for analytical laboratory use.Specification and test methods

2011 GB/T 27581-2011 Electromagnetic interference shielding film.Electroless copper plating solution.Method of determining concentration of Ni and Cu