IEC 60749-40:2011
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

Standard No.

IEC 60749-40:2011

Release Date

2011

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60749-40:2011

Replace

IEC 47/2094/FDIS:2011

Scope

This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment@ where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component. Test method IEC 60749-37 uses an accelerometer to measure the mechanical shock duration and magnitude applied which is proportional to the stress on a given component mounted on a standard board. The detailed specification shall state which test method is to be used. NOTE 1 Although this test can evaluate a structure where the mounting method and its conditions@ the design of a printed wired board@ solder material@ the mounting capability of a semiconductor device@ etc. are combined@ it does not solely evaluate the mounting capability of a semiconductor device. NOTE 2 The result of this test is strongly influenced by the differences between soldering conditions@ the design of the land pattern of a printed wired board@ solder material@ etc. Therefore@ in carrying out this test@ it is necessary to recognize that this test cannot intrinsically guarantee the reliability of the solder joint of the semiconductor devices. NOTE 3 When the mechanical stress which is generated by this test does not occur in the actual application of the device@ implementation of this test is unnecessary.

IEC 60749-40:2011 history

• 2011 IEC 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge