IEC 60539-2:2010
Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors

Standard No.

IEC 60539-2:2010

Release Date

2010

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2010-12

Replace By

IEC 60539-2:2003/AMD1:2010

Latest

IEC 60539-2:2019 RLV

Scope

This part of IEC 60539 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.

IEC 60539-2:2010 history

• 0000 IEC 60539-2:2019 RLV
• 2010 IEC 60539-2:2003/AMD1:2010 AMENDEMENT 1 Thermistances à coefficient de température négatif à chauffage direct – Partie 2: Spécification intermédiaire – Thermistances à coefficient de température négatif pour montage en surface (Edition 1.0)
• 2010 IEC 60539-2:2010 Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors
• 2003 IEC 60539-2:2003 Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification; Surface mount negative temperature coefficient thermistors